Although 2nm advanced semiconductor chips have not yet been put into production, the semiconductor foundry equipment competition has opened the curtain. In order to ensure the smooth deployment of 2nm process technology, TSMC, Samsung and Rapidus have begun the competition in the field of upstream equipment.
Deployment:
TSMC
TSMC announced on September 12 that it is acquiring a 10% stake in Intel subsidiary IMS Nanofabrication for up to $432.8 million.
IMS specializes in the development and production of electron beam lithography, which is widely used in semiconductor manufacturing, optical component production, and MEMS manufacturing.
Industry experts believe that TSMC’s acquisition of IMS will ensure the development of key equipment technology to meet the supply needs for 2nm commercialization.
Samsung:
Samsung previously acquired a 3% stake in ASML and has continued to deepen the cooperation between the two companies. Reports indicate that Samsung is preparing to introduce a next-generation high numerical aperture EUV lithography machine, with a prototype expected to be unveiled later this year and commercially available next year.
Rapidus:
As for semiconductor newcomer Rapidus, it’s crucial to get ASML’s support, as EUV is an important technology for mass-producing sub-5-7nm chips.
ASML will establish a technical support base in Hokkaido, Japan in 2024 and will send about 50 engineers to help set up the EUV lithography equipment on the pilot production line of Rapidus’ 2nm chip factory, providing debugging, maintenance and inspection assistance.
Progress
TSMC:
TSMC is targeting production of N2 technology by 2025, and reports in June indicated that TSMC was fully committed to beginning preparations for pilot production of 2nm chips.
In July, TSMC’s supply chain revealed that TSMC had notified equipment suppliers to start delivering 2nm-related machinery from the third quarter of the following year.
In September, media reports said that TSMC has set up a special 2nm task force, striving to realize risk production next year and start mass production in 2025.
Samsung:
In June, Samsung announced its latest foundry technology innovation and business strategy, unveiling detailed plans and performance levels for mass production of the 2nm process.
Samsung plans to use the 2nm process for mobile applications by 2025, expanding to HPC and automotive electronics in 2026 and 2027, respectively.
Rapidus:
The company plans to pilot-produce 2nm chips in 2025 and begin volume production in 2027.
In July, Rapidus President Atsuyoshi Koike said that operating a pilot line in 2025 and starting volume production in 2027 is an ambitious goal, but progress is on track. He noted that once the company’s 2nm process products are in volume production, they will be priced at ten times the unit cost of logic semiconductors currently produced in Japan.
